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Description
Film Thickness Measurement SystemConfiguration
No ConfigurationOEM Model Description
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.Documents
No documents
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106456
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
SPECTRAFX 100
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106456
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Film Thickness Measurement SystemConfiguration
No ConfigurationOEM Model Description
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.Documents
No documents