Description
No descriptionConfiguration
Optical Defect Inspection Wafer Size : 2 ~ 6 inch Illumination Source : 25 mW laser, 405 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å;; deep. - Pits: 20 μm diameter, 50 Å;; deep - Stains: 20 μm diameter, 10 Å;; thick [ Application ] - Disk substratesOEM Model Description
The Candela OSA 6100 is a system that introduces X-Beam channel technology, which adds radial illumination to the existing circumferential illumination design. It also features advanced collection optics that extend defect sensitivity down to 80nm. This multi-channel system is capable of simultaneously detecting and classifying defects such as particles, pits, and stains. Additionally, it can characterize lubricant thickness and use the Kerr Effect to characterize magnetic imaging.Documents
No documents
KLA
CANDELA OSA-6100
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
101992
Wafer Sizes:
6"/150mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
CANDELA OSA-6100
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
101992
Wafer Sizes:
6"/150mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Optical Defect Inspection Wafer Size : 2 ~ 6 inch Illumination Source : 25 mW laser, 405 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å;; deep. - Pits: 20 μm diameter, 50 Å;; deep - Stains: 20 μm diameter, 10 Å;; thick [ Application ] - Disk substratesOEM Model Description
The Candela OSA 6100 is a system that introduces X-Beam channel technology, which adds radial illumination to the existing circumferential illumination design. It also features advanced collection optics that extend defect sensitivity down to 80nm. This multi-channel system is capable of simultaneously detecting and classifying defects such as particles, pits, and stains. Additionally, it can characterize lubricant thickness and use the Kerr Effect to characterize magnetic imaging.Documents
No documents