Description
No descriptionConfiguration
QZ_DefectOEM Model Description
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.Documents
No documents
Verified
CATEGORY
Defect Inspection
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
144870
Wafer Sizes:
12"/300mm
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML / HMI
eP3
CATEGORY
Defect Inspection
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
144870
Wafer Sizes:
12"/300mm
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
QZ_DefectOEM Model Description
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.Documents
No documents