Overview

The LS9300A-EG (Edge Grip Type) is based on its previous model LS9300A, that is targeted for manufacturing advanced semiconductor devices, with high sensitivity and high throughput. The LS9300A-EG provides an edge grip function, which enables inspection without any contact to the backside of wafers. It is also equipped with a wafer flipping mechanism, which allows defect inspection of both the front and the backside of wafers. As a result, the new system offers advanced analysis capabilities and prediction of device failure caused by defects on the backside of wafers and other factors.