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APPLIED MATERIALS (AMAT) CENTURA AP ISPRINT
    Description
    VIA W
    Configuration
    No Configuration
    OEM Model Description
    Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.
    Documents

    No documents

    APPLIED MATERIALS (AMAT)

    CENTURA AP ISPRINT

    verified-listing-icon

    Verified

    CATEGORY

    CVD (Metalization)
    Last Verified: 25 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    99530

    Wafer Sizes:

    12"/300mm

    Vintage:

    2006

    Have Additional Questions?
    Logistics Support
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    Transaction Insured by Moov
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    APPLIED MATERIALS (AMAT) CENTURA AP ISPRINT
    APPLIED MATERIALS (AMAT)CENTURA AP ISPRINTCVD (Metalization)
    Vintage: 0Condition: Used
    Last Verified26 days ago
    APPLIED MATERIALS (AMAT) CENTURA AP ISPRINT
    APPLIED MATERIALS (AMAT)CENTURA AP ISPRINTCVD (Metalization)
    Vintage: 2006Condition: Used
    Last VerifiedOver 60 days ago

    APPLIED MATERIALS (AMAT)

    CENTURA AP ISPRINT

    verified-listing-icon

    Verified

    CATEGORY

    CVD (Metalization)
    Last Verified: 25 days ago
    listing-photo-0a56b9d9805541138047aca78f2f4d9e-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    99530

    Wafer Sizes:

    12"/300mm

    Vintage:

    2006

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    VIA W
    Configuration
    No Configuration
    OEM Model Description
    Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.
    Documents

    No documents

    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) CENTURA AP ISPRINT
    APPLIED MATERIALS (AMAT)
    CENTURA AP ISPRINT
    CVD (Metalization)Vintage: 0Condition: UsedLast Verified: 26 days ago
    APPLIED MATERIALS (AMAT) CENTURA AP ISPRINT
    APPLIED MATERIALS (AMAT)
    CENTURA AP ISPRINT
    CVD (Metalization)Vintage: 2006Condition: UsedLast Verified: Over 60 days ago