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APPLIED MATERIALS (AMAT) NANOSEM 3D
  • APPLIED MATERIALS (AMAT) NANOSEM 3D
  • APPLIED MATERIALS (AMAT) NANOSEM 3D
  • APPLIED MATERIALS (AMAT) NANOSEM 3D
Description
No description
Configuration
Software Version: 14.3.0 CIM: SECS/GEM Process: CDSEM Main System: AMAT NanoSEM 3D (1) OK Handler System: ETU (1) OK Factory Interface: FOUP Dry Pump (2) OK
OEM Model Description
Introduced in fiscal 2002, the NanoSEM 3D system extends CD-SEM technology beyond the measurement of critical dimensions to enable the three-dimensional imaging of chip features to more precisely control their lithography and etch processes.
Documents

No documents

CATEGORY
CD-SEM

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

111894


Wafer Sizes:

12"/300mm


Vintage:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

NANOSEM 3D

verified-listing-icon
Verified
CATEGORY
CD-SEM
Last Verified: Over 60 days ago
listing-photo-ece70ab333ed41df83ed3439969f5a21-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

111894


Wafer Sizes:

12"/300mm


Vintage:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
Software Version: 14.3.0 CIM: SECS/GEM Process: CDSEM Main System: AMAT NanoSEM 3D (1) OK Handler System: ETU (1) OK Factory Interface: FOUP Dry Pump (2) OK
OEM Model Description
Introduced in fiscal 2002, the NanoSEM 3D system extends CD-SEM technology beyond the measurement of critical dimensions to enable the three-dimensional imaging of chip features to more precisely control their lithography and etch processes.
Documents

No documents