ACCRETECH next generation systems support optimum device productions.

Stand-alone wafer cleaning unit, A-CS-1OOA will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.
■ Maximum rotation speed of spinning table is up to 3,000 min-1
■ Available frame size: 5 to 8"
■ Cleaning method: High-pressure
Rinse Air dry (Driven by swing arm)

ACCRETECH / TSK

A-CS-100A

Stand-alone wafer cleaning unit, A-CS-300 provides best solution for cleaning and drying the wafer cut by semi-automatic dicing saws. Air accelerated water nozzle and horizontal swing arm achieves excellent cleaning quality.

ACCRETECH / TSK

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Top ACCRETECH / TSK Cassette Cleaning System

A-CS-100A

A-CS-300

ACC300

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