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Marketplace > Bonders > SHINKAWA > UTC 1000 SUPER

UTC 1000 SUPER

Category
Bonders
Overview

The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator

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