F&K Delvotec G5 is a fully automatic all-in-one wire bonder. The compact, space saving G5 single wire bonder is truly a multi-talent. Within minutes it can be changed to all common bonding processes. For highest productivity with lowest operating costs applications specialists from F&K determine the level of automation required for the customer’s product exactly."

F&K DELVOTEC

Base System, plus itemized options as listed below:
- Bond process Control System BPC2000 Option 
- Deep Access Thin Wire bond head option 
- Thin Wire Spool Option
- BPD Viewer Option 

Base System: 
- Standard bonding area X/Y: 254mm x 152mm (10” x 6”)

Modular machine concept including:
- Main components
- Extremely rugged machine frame
- Minimum dimensions of required floor space: 
1777mm x 620mm x 1273mm - (height x width x depth)
- Working height adjustable from 850mm -1050mm, fulfil SMEMA requirement (940-965 mm)
- Control and power electronics based on industry standards

- Pentium®M based cPCI CPU Unix®
- Based real time multi
- Tasking operating system
- High capacity hard disk drive (>60 GB, ruggedised system)
- Standard network connectivity TCP/IP, SMEMA, SECS/GEM
(SEMI E30), HSMS graphical multi - window user interface
- 19“ TFT flat screen monitor
- Menu controlled teach-in
- Direct parameter input
- Pattern recognition display
- Process status & message display
- Service interface
- Linear drive X -Y table with 10“ x 6“ bond area
- X = 254 mm (10”); Y = 152 mm (6”); Z = 40 mm
- High resolution linear encoders in X and Y
- AC servo motor with absolute encoder in Z and P axes
- High speed numeric control system
- Programmable dual source work area lighting
- Electronic touch down sensor for every bond
- Individual height sensing per component or bond pad

Microscope:
- Stereo zoom
- Adjustable
- Light intensity
- Status Light
- Easy programmable

Ultrasonic Generator:
- Digital F&K Delvotec ultrasonic system
- Voltage, current or power controlled
- Programmable from 30 to 250 kHz operating frequency
- Up to 40 watts ultrasonic power output

Pattern recognition unit PRU:
- CCD camera with custom optics adapted to product
- Moving camera in Z axis
- Programmable focus for each recognition point
- Cognex®8000 Pat Max®system
- 256 grayscale processing
- Pattern recognition
- Edge recognition
- Tilted image option
- Programmable size search window
- 640 x 480 Pixel Camera
- Process adjustment
- Programme complexity virtually unlimited
- Up to 150 chips recognition reference images
- Up to 50.000 wires
- No restriction on bond height within work area
- Programmable force / time ramp
- Bond parameter settings
- Offset values per program
- Standard values per chip
- Individual settings per bond
- Loop shape settings
- Automatic or programmed loop height setting
- Automatic control of bond height
- Standard values per program
- Standard values per chip
- Individual settings per wire work area lighting
- Program controlled type and intensity
- Direct red LED standard

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