Description
Wafer bonding systemConfiguration
SOI and direct wafer bondingOEM Model Description
The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).Documents
No documents
Verified
CATEGORY
Bonders
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154221
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 XT
CATEGORY
Bonders
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154221
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer bonding systemConfiguration
SOI and direct wafer bondingOEM Model Description
The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).Documents
No documents