Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.Documents
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ASM
EAGLE XTREME GOCU
Verified
CATEGORY
Bonders
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
62922
Wafer Sizes:
Unknown
Vintage:
2014
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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ASM
EAGLE XTREME GOCU
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
62922
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.Documents
No documents