EAGLE XTREME GOCU
Category
BondersOverview
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.
Active Listings
8
Services
Inspection, Insurance, Appraisal, Logistics
Top Listings
- EAGLE XTREME GOCUBondersVintage: 2013Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2010Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2010Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2010Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2012Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2014Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2017Condition: UsedLast VerifiedOver 60 days ago
- EAGLE XTREME GOCUBondersVintage: 2014Condition: UsedLast VerifiedOver 60 days ago