Description
No descriptionConfiguration
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM Model Description
None ProvidedDocuments
No documents
TEL / TOKYO ELECTRON
SYNAPSE
Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
44844
Wafer Sizes:
12"/300mm
Vintage:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
CATEGORY
Bonder/Debonder
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
44844
Wafer Sizes:
12"/300mm
Vintage:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM Model Description
None ProvidedDocuments
No documents