Description
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.Configuration
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM Model Description
None ProvidedDocuments
No documents
TEL / TOKYO ELECTRON
SYNAPSE
Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
44844
Wafer Sizes:
12"/300mm
Vintage:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
44844
Wafer Sizes:
12"/300mm
Vintage:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.Configuration
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM Model Description
None ProvidedDocuments
No documents