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TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
  • TEL / TOKYO ELECTRON SYNAPSE
Description
No description
Configuration
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)
OEM Model Description
None Provided
Documents

No documents

TEL / TOKYO ELECTRON

SYNAPSE

verified-listing-icon

Verified

CATEGORY
Bonder/Debonder

Last Verified: Over 60 days ago

Key Item Details
Condition:

Used

Operational Status:

Unknown

Product ID:

44844

Wafer Sizes:

12"/300mm

Vintage:

2015

Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
TEL / TOKYO ELECTRON SYNAPSE

TEL / TOKYO ELECTRON

SYNAPSE

Bonder/Debonder
Vintage: 2015Condition: Used
Last VerifiedOver 60 days ago

TEL / TOKYO ELECTRON

SYNAPSE

verified-listing-icon
Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/a1ecd857d4f64efb9dcffed68af97e2f_img20210622wa0019_mw.jpg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/0ea5378ccdd14f498bbce46a1f5d145b_2835f5e0a5be43028787f08d09c1ed1e1105c_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/b983296e86544c718fd20b05cb6a792b_b2d11841a903492fa46c7a5d29fe4fd4_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/1bd3d4a7a4a643a18069aad0001cd009_215ae68f9bef4386b31b4ac9699c1068_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/8fc1eec79a934b59b213bdf58d6f481c_c880514f1ec74c40ab52469ba0b6accd_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/a977630bb21f4449b99de317c9d329cf_adbd1357f69f481db4d4a74cdc15a432_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/bd958e00cdb1451d8f5290e9cc0dea08_8805b6ba78b345d8b505ae817105884c_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/a8a71d7578ec43d5aea836d53ae7db92_842eb8ddec4c4864887c0bf1e5e0f52d45005c_mw.jpeg
listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/5976fd809e16457389ee2733bc96ba01_f10fb35b8712493aaed64781fad1972f_mw.jpeg
Key Item Details
Condition:

Used

Operational Status:

Unknown

Product ID:

44844

Wafer Sizes:

12"/300mm

Vintage:

2015

Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)
OEM Model Description
None Provided
Documents

No documents

Similar Listings
View All
TEL / TOKYO ELECTRON SYNAPSE

TEL / TOKYO ELECTRON

SYNAPSE

Bonder/DebonderVintage: 2015Condition: UsedLast Verified:Over 60 days ago