Description
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-Software Version: Standard -CIM: SECS GEM -Process: Wafer Bonding Main System Main Tool OK Handler System Standard 1 OKOEM Model Description
Synapse™ V is a 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Temporary bonder system, capable of coating, baking and bonding in one tool.Documents
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TEL / TOKYO ELECTRON
SYNAPSE V
Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106065
Wafer Sizes:
12"/300mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
SYNAPSE V
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106065
Wafer Sizes:
12"/300mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
-Software Version: Standard -CIM: SECS GEM -Process: Wafer Bonding Main System Main Tool OK Handler System Standard 1 OKOEM Model Description
Synapse™ V is a 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Temporary bonder system, capable of coating, baking and bonding in one tool.Documents
No documents