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Description
No descriptionConfiguration
INSITU Bonder is applicable only to 8” wafers; it working principle is to bond two wafer with surface having metal compound, under high temperature and pressure -Incorporate with Formic acid for cleaning function after removal of oxide from wafer surface Performance: -High temperature bonding option → up to 450°C -Alignment accuracy → ± 3μm @ high temperature Typical Applications: -TSV – Si-SiOEM Model Description
Synapse™ V is a 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Temporary bonder system, capable of coating, baking and bonding in one tool.Documents
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Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102768
Wafer Sizes:
8"/200mm
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
SYNAPSE V
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102768
Wafer Sizes:
8"/200mm
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
INSITU Bonder is applicable only to 8” wafers; it working principle is to bond two wafer with surface having metal compound, under high temperature and pressure -Incorporate with Formic acid for cleaning function after removal of oxide from wafer surface Performance: -High temperature bonding option → up to 450°C -Alignment accuracy → ± 3μm @ high temperature Typical Applications: -TSV – Si-SiOEM Model Description
Synapse™ V is a 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Temporary bonder system, capable of coating, baking and bonding in one tool.Documents
No documents