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TAZMO TWS-DC3111
    Description
    Debond (Frame) [InFO]
    Configuration
    No Configuration
    OEM Model Description
    Specialized semiconductor manufacturing tool used as a wafer demounter (or debonder) for ultra-thin wafers in advanced 2.5/3D packaging
    Documents

    No documents

    TAZMO

    TWS-DC3111

    verified-listing-icon

    Verified

    CATEGORY
    Bonder/Debonder

    Last Verified: 25 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    151445

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    TAZMO TWS-DC3111

    TAZMO

    TWS-DC3111

    Bonder/Debonder
    Vintage: 0Condition: Used
    Last Verified25 days ago

    TAZMO

    TWS-DC3111

    verified-listing-icon
    Verified
    CATEGORY
    Bonder/Debonder
    Last Verified: 25 days ago
    listing-photo-c0008ba276554a1f9a665ebd0e7b1f53-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    151445

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Debond (Frame) [InFO]
    Configuration
    No Configuration
    OEM Model Description
    Specialized semiconductor manufacturing tool used as a wafer demounter (or debonder) for ultra-thin wafers in advanced 2.5/3D packaging
    Documents

    No documents

    Similar Listings
    View All
    TAZMO TWS-DC3111

    TAZMO

    TWS-DC3111

    Bonder/DebonderVintage: 0Condition: UsedLast Verified:25 days ago