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ULVAC NA-8000
  • ULVAC NA-8000
  • ULVAC NA-8000
  • ULVAC NA-8000
Description
NA 8000 Ashing
Configuration
No Configuration
OEM Model Description
The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Ashers / Plasma Cleaner

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

72903


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ULVAC

NA-8000

verified-listing-icon
Verified
CATEGORY
Ashers / Plasma Cleaner
Last Verified: Over 60 days ago
listing-photo-7e8fa06c83af48a1859661431b0abac0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

72903


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
NA 8000 Ashing
Configuration
No Configuration
OEM Model Description
The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.
Documents

No documents