Description
ETCHConfiguration
No ConfigurationOEM Model Description
The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.Documents
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AXCELIS / FUSION
FUSION ES3
Verified
CATEGORY
Ashers / Plasma Cleaner
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
47124
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AXCELIS / FUSION
FUSION ES3
CATEGORY
Ashers / Plasma Cleaner
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
47124
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ETCHConfiguration
No ConfigurationOEM Model Description
The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.Documents
No documents