Description
SPI ParmiConfiguration
SpecOEM Model Description
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.Documents
No documents
PARMI
XCEED MICRO
Verified
CATEGORY
AOI
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
99699
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PARMI
XCEED MICRO
CATEGORY
AOI
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
99699
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
SPI ParmiConfiguration
SpecOEM Model Description
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.Documents
No documents