Description
No descriptionConfiguration
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM Model Description
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.Documents
No documents
Verified
CATEGORY
AOI
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152849
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
CATEGORY
AOI
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152849
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM Model Description
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.Documents
No documents