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KLA / ORBOTECH ULTRA FUSION 300
    Description
    No description
    Configuration
    Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mm
    OEM Model Description
    Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.
    Documents

    No documents

    KLA / ORBOTECH

    ULTRA FUSION 300

    verified-listing-icon

    Verified

    CATEGORY
    AOI

    Last Verified: 10 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    152851

    Wafer Sizes:

    Unknown

    Vintage:

    2014

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    KLA / ORBOTECH ULTRA FUSION 300

    KLA / ORBOTECH

    ULTRA FUSION 300

    AOI
    Vintage: 2014Condition: Used
    Last Verified10 days ago

    KLA / ORBOTECH

    ULTRA FUSION 300

    verified-listing-icon
    Verified
    CATEGORY
    AOI
    Last Verified: 10 days ago
    listing-photo-78bdd0888c124f818fd00443f2bebb69-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76342/78bdd0888c124f818fd00443f2bebb69/3b19805f97484f5cbd6261fdfa6d2b13_f3873d058e6a4d3193137e9dc943d83145005c_mw.jpeg
    listing-photo-78bdd0888c124f818fd00443f2bebb69-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76342/78bdd0888c124f818fd00443f2bebb69/6fe7c5ed7a7844dbb2c7e60fdb5e283e_f3760475f8d341039d862588858ad30e45005c_mw.jpeg
    listing-photo-78bdd0888c124f818fd00443f2bebb69-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/76342/78bdd0888c124f818fd00443f2bebb69/853ba32ebb164f0d86cc5ea1459515e1_cc32ba8529ef41d69c1a5014ba49f05a45005c_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    152851

    Wafer Sizes:

    Unknown

    Vintage:

    2014

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mm
    OEM Model Description
    Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.
    Documents

    No documents

    Similar Listings
    View All
    KLA / ORBOTECH ULTRA FUSION 300

    KLA / ORBOTECH

    ULTRA FUSION 300

    AOIVintage: 2014Condition: UsedLast Verified:10 days ago