QUALISURF QSF-900
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AnalyticalOverview
-Process Line FEOL -Applications Sigma Anisotropic Etch (TMAH) Si Etch / SiGe / GAA / Polysilicon Etch / Photoresist Strip, Removal and Rework -Benefits: Multiple components are measured by NIR, < 5 mins. per tank / Superior selectivity for Si Etch
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