ULTRON SYSTEMS

UH104

UH114-12

UH104-12

UH105

UH 117

UH102-8

UH114-8 set the benchmark for control and
versatility. For dicing/sawing applications, uniform adhesive plastic film
lamination is paramount. The mounters feature an easily adjustable
spring-loaded roller assembly, along with film tensioner bars along
both the x- and y-axes to assure bubble-free lamination of the film to
the wafer and film frame. In addition, both models feature a retractable
film cutting system with adjustable cutting pressure to accommodate
various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements
and to accommodate various wafer thicknesses. A digital temperature
controller assures consistent workstage temperatures for repeatable
mounting. Adjustable alignment pins and vacuum cups accommodate
almost any type of film frame, including plastic. The workstage height
is also adjustable relative to the frame height for different wafer thicknesses.

UH114-8

The Ultron Systems Model UH114/114-8 Wafer/Frame Film Applicators offer a high degree of control and versatility for your mounting requirements in affordable and easy-to-use benchtop packages. A wide range of standard features and available options assure bubble-free lamination to all sizes of wafers and types of film frames.

UH114

UH130

ULTRON SYSTEMS

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UH104

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