Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.

The IP750EMP is a powerful and flexible testing system built with Teradyne’s J750 VLSI test platform, which has over 1,700 systems installed worldwide. It is an upgrade to the IP750 series systems and can be easily upgraded on-site to the IP750EP and the IP750EMP with enhanced image data processing speed to adapt to today’s rapidly changing market. The IP750EMP is designed for shorter test time, featuring a multiple-PC architecture that allows image data processing (IDP) for multiple sites to be done individually but simultaneously. This provides a flexible solution for the needs of large IDP device testing. With its advanced capabilities, the IP750EMP is a reliable and efficient choice for your testing needs.

TERADYNE

IP750EMP

The J750 Family of semiconductor test systems by Teradyne is a compact and economical solution that delivers high-efficiency parallel test in a small system footprint. The J750 Family is available in 512 pin, 1024 pin, and J750k configurations, each with its own set of features and capabilities. The 512 pin and 1024 pin configurations both have a clock speed of 100 MHz, while the J750k has a clock speed of 66 MHz / 33 MHz. All configurations come with IG-XL software built on Windows and Microsoft Excel, and offer various options for memory test, converter test, mixed signal test, RFID, scan, APMU channels, high voltage drivers, and device power supplies. 

J750

Also known as UltraFLEX. Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.

UFLEX

** PARTS **

The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.

microFLEX

Also known as Integra FLEX. Teradyne iFlex is an advanced test solution provided by Teradyne, a leading automated test equipment supplier. It is designed to meet the testing needs of a wide range of electronic devices, including integrated circuits (ICs) and system-on-chips (SoCs). iFlex is a flexible and scalable platform that enables functional and parametric testing. It offers configurable instrumentation, allowing users to choose digital and analog instruments to suit their testing requirements. The system supports parallel testing of multiple devices, enhancing throughput and reducing test time. iFlex provides a comprehensive test development environment with software tools and libraries, making test program development efficient. It also offers test data analysis capabilities, enabling manufacturers to gain insights and generate detailed reports. The system is scalable and can be expanded to accommodate growing test needs. In summary, Teradyne iFlex is a versatile and adaptable test solution that helps manufacturers improve efficiency, reduce costs, and maintain high product quality.

IFLEX

The J750Ex is a low cost, high efficiency parallel test system for advanced microcontrollers and consumer SoC package test & wafer sort. It is built on the foundation of the J750, one of the most successful test platforms in ATE history. The J750Ex provides highly economical parallel test solutions for high-performance microcontrollers, consumer SoC devices, and digital wafer sort applications. It offers high parallel test configuration with 50% higher throughput and 99% parallel test efficiency. All J750 systems are DIB compatible and can run tens of thousands of J750 test programs. The J750Ex has a range of features including up to 1024 digital pins, 96 device power supplies, and analog test capability, as well as enhanced DFT capability with 196 Gbit scan depth and deep diagnostic capture. It also has a per-pin test architecture, pattern-controlled instrumentation, and flexible site mapping with no slot boundaries. The system is air-cooled and has a “Zero footprint” tester-in-a-test-head design for minimum floor space.

J750EX

Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.

CATALYST

The IP750Ex is a cost-effective image sensor test solution developed by Teradyne. It offers high throughput with dual core DSP and high speed data transfer at 10Gbps per instrument parallel, and can test up to 32 sites in parallel with 1024 digital pin configuration. It has broad device coverage, with the ability to test devices ranging from VGA to 32M pixels, and strong SOC test capability with the new HSD200 digital instrument. The IP750Ex is built on Teradyne’s J750 test platform, and is compatible with IP750EP/EMP test programs.

IP750Ex

FLEX

The Teradyne IP750 is a high-performance in-circuit test system used for testing printed circuit boards (PCBs) and electronic assemblies. It is widely utilized in the electronics manufacturing industry for functional testing, fault detection, and quality assurance of PCBs. Key features of the IP750 include in-circuit testing (ICT), high-speed testing, multi-site testing, comprehensive test coverage, powerful diagnostics, programmability, flexibility, and integration with manufacturing systems. Teradyne is a leading supplier of automated test equipment, and the IP750 is one of their popular offerings in the field of in-circuit testing.

IP750

The UltraFLEX-HD is the newest member of the UltraFLEX family of test systems, optimized for testing high-performance digital and SoC devices. It delivers the power and precision needed for testing advanced microprocessors, PC chipsets and graphics, disk drives, video game devices, System on a Chip (SoC) or System in Package (SiP), memory, baseband digital, network, and broadband. The UltraFLEX-HD achieves lower cost of test through faster test times and higher parallel efficiency, all in a small 2m x 2m footprint.

UFLEX-HD

The J750Ex-HD offers the lowest cost test solution for uncompromised test quality of less complex mixed signal devices. The J750Ex-HD is well-known for its ‘zero footprint’ design minimizing use of valuable manufacturing floor space. The scalability of the test system, to 2048 multifunction pins and data rates up 400 MHz/800 Mbps, makes it ideal for low-cost devices with increasing feature integration.

J750EX-HD

The IP750EP is a powerful digital test system designed for the testing needs of CCD/CMOS image sensor devices. It features a 100 MHz digital test capability and supports CCD devices exceeding 10 Megapixels, as well as the digitized pixel capture function required of CMOS image sensors. With high-speed, multisite parallel testing capability up to 16 in parallel, the IP750EP helps to reduce test costs. The system also features IG-XL software, which combines the performance of the latest PC technology and Windows operating system with familiar Microsoft Windows® productivity tools (Microsoft Excel® and Visual Basic) to speed up program development. Overall, the IP750EP is a versatile and efficient solution for testing CCD/CMOS image sensor devices.

IP750EP

A360

UltraFLEX-SC is an optimized test system designed for testing high-performance digital and system-on-a-chip (SoC) devices. It provides the functionality and accuracy required to test complex SoC devices designed for mobile applications, networking, storage, and high-end use. With its 24 slot test system, UltraFLEX-SC is the perfect choice for devices that require high throughput, high-speed signals, precision signals, wide test coverage, and highly parallel test.

UFLEX-SC

GENARD 228X ICT

IP750S	

D750Ex

Channel Count: 384-2560
VXI Card Cage Slots: Up to 20 channel cards or VXI instruments + 1 VXI instrument
Footprint: 14.6 square feet 1.36 square meters

SP8852

SP8852E

HSD200

J994

Channel Count: 1536-5120
VXI Card Cage Slots: Up to 40 channel cards or VXI instruments + 3 VXI instruments
Footprint: 19.25 square feet 18 square meters

SP8855

J993

VHFAC (Very High Frequency AC) is a type of AC instrument used in microFLEX/FLEX test systems. It provides waveform source and capture capabilities with arbitrary waveform generators (AWG) and digitizers. This allows for the testing of high-performance devices such as SoC and SiP devices at low test costs, as it can meet various test requirements. VHFAC is an important tool for ensuring the performance and reliability of these devices.

VHFAC

IA-OPT585WX

39-026-31

A575

HSD 100

DC75

J750E

A563

J273

A580

Z1890

A590

The DC30 is a voltage and current source that extends the DC voltage to 30V to meet high voltage testing requirements such as mobile power management devices. It has a precision differential voltmeter and time measurement capability, similar to the UltraVI80.

DC30

A530

J971

Z-1800

J750 HDDPS 24CHANNEL-E

TESTSTATION LHS

A570

The Teradyne Z1860vp is a high-performance, multi-site test system designed for testing advanced semiconductor devices. It is a member of the Z18xx series of testers, which are known for their high throughput, high accuracy, and flexibility.

The Z1860vp is designed to test a wide range of devices, including memory, logic, mixed-signal, and high-speed devices. It features high-speed digital and mixed-signal measurement capabilities, as well as high-resolution analog measurements. The system also has a large number of digital I/O channels and can be configured with a variety of different testheads and probers to support different device types and package sizes.

The Z1860vp also features a powerful software platform that allows for easy test program development and maintenance. It also supports various programming languages such as C, C++, TCL and other languages, it also has built-in tools for test program debugging and analysis.

The Z1860vp is well suited for high-volume manufacturing environments, where high throughput and high accuracy are required. It is also well suited for testing devices with high pin counts and complex test requirements. It is ideal for use in semiconductor manufacturing facilities, fabless semiconductor companies, and IDMs.

Overall, the Teradyne Z1860vp is a powerful and versatile test system that can be configured to meet the needs of a wide range of device testing applications.

Z1860VP

A510

Z1808

A585

High Density Converter Test Option (HDCTO) for testing embedded ADC/DAC converters.

HDCTO

A3604

806-118-01

A550

J973

TESTSTATION LH

A500

TIGER

J937

A520

A535

J283

A565

J941

A540

MANIPULATOR

J971SP

Also known as UltraFLEXplus
UltraFLEX plus meets new digital testing challenges with the latest innovative PACE TM  architecture. At the same time, the user can install the latest release of his IG-XL on any of his UltraFLEXs and develop test programs that can be run on both UltraFLEX and UltraFLEX plus.

UFLEXplus

TSLH 121

J967

A370

The J750 HD Probe Tower is an advanced piece of technology designed to keep up with the latest J750 EX and IP750 instrumentation, such as the HOVIS, ICUL, LCD, and future instruments. It increases the physical spring pin count of the standard J750 1024 Pin Tower while providing the same improved electrical performance as the J750 EX Tower. With a total pin count of 5848, compared to the 2992 pins of the standard tower, it represents a 95% increase. This expanded pin count enables multisite testing, allowing for more system resources to be connected to more DUTs. The HD tower retains the same mechanical outlines as the standard prober and uses the same J750 1024 probe card form factor, providing docking interface compatibility. Based on proven spring pin technology, this 300mm probe tower offers unmatched reliability, uptime, and flexibility. It’s an impressive piece of technology that is sure to improve testing capabilities.

J750HD

UltraPin is also known as UP. The UltraPin1600 is a high-density, high-speed digital instrument that can cover speeds of up to 2.2 Gbps and offers either 128 or 256 channels per instrument. It is equipped with multi-core, hardware-based advanced protocol-aware features, allowing for pin group-wise operation to be synchronized with the device data rate and timing. This eliminates the need for digital pattern programming for communication in standard databus protocols. The UltraPin1600 also has dedicated hardware for same-cycle source-synchronous and walking-strobe timing measurements, making it ideal for high-speed DDR and other critical applications. Additionally, the UltraPin1600 is compatible with test programs created with its legacy UltraPin800 and HSD1000 digital options. This makes it a versatile and powerful tool for a wide range of applications.

UltraPin1600

HEXVS

UltraFLEX-XC is a 36-slot test system that offers three different test heads to optimize capital investment, footprint, and maximum number of instruments. All three test heads can use the same DIB (Device Interface Board), ensuring application portability and efficient instrumentation reuse and production flexibility. The test heads have a universal slot architecture, allowing any instrument to be placed in any slot.

UFLEX-XC

J259

BBAC

TSLH 128

HEXVS+

J972

Z1888-2

HSD1000

TSLH 124

J995

HDVS

J921

PDU-807816

TSLX w/ 128L

UltraPin is also known as UP

The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.

UltraPin800

HD DPS24

J997

MICROFLEX RF

CATALYST RF

TXP universal column manipulator provides the widest range of motion, smallest footprint and lightest floorloading of any manipulator in its weight class.

L321

Channel Count: 384-1280
VXI Card Cage Slots: Up to 10 channel cards or VXI instruments
Footprint: 9.1 square feet 0.84 square meters

Dimensions: 
Length: 41 inches / 104 cm
Depth: 32 Inches /81 cm
Height: 32.5 inches / 83 cm

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