SEMICONDUCTOR EQUIPMENT CORP. (SEC)

X-EYE SF160

3150

X-EYE 5130FSL

High-Speed In-Line 3D CT Inspection System
Automatically inspects the defects of products in the customer's line with high-speed 3D CT tomography.
Able to inspect every defect of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.
Inspection speed of 3.5sec/FOV from loading to automatic Good/NG judgment.

X-eye 6300

SF-160

X-EYE 5000B

3250	

X-EYE 5000A

SNE-4500

x-eye 3100

4460

4400

Multi-use semiautomatic die bonder ideal for R & D and low volume production.

860 EAGLE

3100

A complete system includes a Die Ejector Grid (suitable for die which are at least 3mm or larger on one side) mounted to a combination warming plate and vacuum chamber. A separate console houses a temperature controller, vacuum switch and power switch (see exploded view). Individual parts of the system can also be purchased separately.
In operation, a sawed or scribed wafer, mounted on a film frame or ring set, is placed over the grid, consisting of a series of closely spaced points. Vacuum and a low temperature (approximately 170°F) are applied through the grid to the back side of the wafer mounting tape. The vacuum pulls the tape from the back of the wafer into the valleys between the rows of points. Lifting the die from the tape with a tweezers, vacuum pencil or vacuum collet, is then a very simple matter. The Model 4800 will accommodate all film frames or ring mounting sets.

4800

SEMICONDUCTOR EQUIPMENT CORP. (SEC)

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X-EYE SF160

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