PARMI

XCEED

SPI HS60

SIGMA X 

‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.

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XCEED

SPI HS60

SIGMA X

XCEED MICRO

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