OPTO SYSTEM

WMSS2000

OBM-90TP

WDS2200	

WPS3100

OSM-90TS

WBS6000

This system is a device that converts scribed wafers into chips with break blades. Alignment is performed automatically by image processing. In addition, it is a fully automatic specification that automatically feeds wafers from a cassette containing rings.

1) General-purpose material wafer
2) Wafer size 8 inches or less　
3) Chip size 200 μm square or more Aspect ratio 1.5 or more
4) Workpiece mounting accuracy ±3 mm or less

OPTO SYSTEM

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WMSS2000

OBM-90TP

WDS2200

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