HANMI

3800L

HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.



FLIP CHIP BONDER-A110

WLP2152

3000S

The Hanmi 3000D is a singulation (sawing) and placement machine designed to handle tiny QFN packages efficiently. It offers a high UPH (units per hour) of 25,000 with a fast saw feeding rate of 25mm/sec. The machine features no vision sorting, a bin offloader, and an optimal solution for addressing issues like warpage, shrinkage, and bent trays. It minimizes equipment downtime and jamming, while allowing for easy and quick conversions in just 10 minutes. Maintenance can be performed from the front, back, and right side of the machine, and it incorporates a dual spindle implementation.

3000D

2000D

LASER CLEANING 1.0

The Hanmi 3500D is a sawing and placement system designed for high productivity, offering a UPH (units per hour) of 14,000. It is optimized to handle ultra-small QFN packages efficiently. With its optimal solution for addressing issues like warpage, shrinkage, and bent trays, it minimizes equipment downtime and jamming. The machine allows for easy and quick conversions in just 9 minutes and supports maintenance from the front, rear, and right side. It features a dual spindle implementation for enhanced performance.

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3800L

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FLIP CHIP BONDER-A110

WLP2152

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