FSI International, Inc. and YieldUP International Corporation announced that the two companies have entered into a definitive agreement for FSI to acquire YieldUP; YieldUP has also granted FSI a royalty-bearing license to its patent portfolio.

FSI International, Inc. was acquired by TEL and the new company profile is TEL FSI, Inc.

TEL / FSI

POLARIS 3500

ZETA 300 G3

**PARTS**

EXCALIBUR

ANTARES

ORION

SATURN OC

The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.

MERCURY MP

POLARIS 2200

ZETA 300

The ZETA™ 200 is a fully automated system that can transfer wafer batches from incoming SMIF pods to the process chamber in a full mini-environment, ensuring minimal added particles. The system features the unique, high-temperature ViPR™ process for high-performance and low-cost stripping of resist, silicide, and other films. Batch spray processing provides a more economical alternative to single wafer resist strip solutions. The ZETA™ 200 can be configured with up to 8 different chemical inputs to a single, closed chamber, providing the flexibility to blend chemicals or change mix ratios and temperatures within a recipe. This system is also available in 300mm as the ZETA™ 300.

ZETA 200 

CHEMFILL 1000

Mercury® Surface Conditioning Systems perform submicron cleaning, etching, and photoresist stripping applications. They are designed to help ensure that silicon wafers are free from contamination and ready for further processing.

MERCURY

The Polaris 2000 Cluster is a next-generation system introduced by the Microlithography division of FSI near the close of fiscal 1994. The system boasts higher throughput and enhanced productivity, with a new high capacity feature that allows the robotic handler to move horizontally within the cluster and access more modules. The Polaris 2000 Cluster tool is positioned in both the high throughput manufacturing arena and the leading edge high-resolution technology area, making it attractive for customers who require “mix and match” capability in their manufacturing lines.

POLARIS 2000

The ZETA Surface Conditioning System is a fully automated centrifugal spray processor designed for advanced, batch cleaning, etching and stripping applications on 200-mm and 300-mm wafers. The system is completely closed, providing greater process control and repeatability in an extremely clean environment. Compared to traditional wet cleaning technologies, the ZETA system uses less fab space and chemicals and operates at a much lower cost. It performs a variety of etching applications, including patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.

ZETA

CT200	

MERCURY OC

SATURN MP

MERCURY+ includes a new, advanced control system that ensures that a proven technology, with over 1,000 systems installed worldwide, will continue to be a solution for years to come.

Supporting 75mm – 200mm wafers, the MERCURY+ addresses the industry’s need for a lower-cost batch spray solution. The new MERCURY control system includes replacements for obsolete components such as a new CPU, touchscreen interface, pneumatic card rack, input-output interface and motor speed controller. In addition, the new control system extends the system’s functionality with additional monitoring, data logging and maintenance functions, and is capable of running standard MERCURY processes without the need for requalification. 

MERCURY +

TITAN MP

SCORPIO

OMEGA 4000

OMEGA 6200

TEL offers the new ANTARES™ – Nano which features a smaller aerosol size for improved removal efficiency in the smallest nanoparticle size range, plus improved capability for cleaning sensitive patterns without damage. Semiconductor manufacturers have advanced their technology through recent generations by introduction of various new materials, a trend which will continue for the foreseeable future. In many cases the materials have sensitivities which limit the applicability of historical wet clean processes for removing contaminants. Metals are easily corroded, hydrophobic films are prone to watermarks, and some materials such as Ge can be attacked by aqueous chemistries. Furthermore, even traditional materials such as Si and SiO2 frequently must be cleaned with near-zero material loss, due to tightened dimensional requirements. Therefore, this ANTARES™ -Nano presents cleaning methods that are safe for all materials and patterns are increasingly needed.

ANTARES -Nano

POLARIS 2500

MAGELLAN

m.FSI: OA2600S ozone asher, 6-inch wafers.

OA2600S

The ARIES system uses inert, frozen gas crystals to remove particles from the surfaces of process wafers, thus producing higher device yields.

ARIES

POLARIS 1000

m.FSI: OA2800 ozone asher, 8-inch wafers.

TEL / FSI

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