ENGIS

HVG-300

EJ-380IN

Fast Lap Lapping and Polishing Machine with Engis Hyprez Auto stirrer with Speed Control

15FL110v

FL-24V

Lap Plate Diameter	15" 381 mm
Maximum part Diameter (inside work ring): 5-7/16" 138 mm
Work Stations/Rings: 3
Maximum Plate Speed: 90 rpm

FL15

EHG-180

EJW-910T-4AL

Standard Ring Size: 286 mm x 250 mm
Workpiece Size: 248 mm

EJW-610I

24FL230VP

The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.

EJD-9BL

SSM36P-N

EVG-300

EJW-460IFN

36SFL60VP-01

Designed to grind advanced materials, such as sapphire, aluminum nitride and garnet. It is also capable of performing wafer back-side
grinding operations and achieving a
high degree of flatness, as well as high
quality surface finishes. 

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HVG-300

EJ-380IN

15FL110v

FL-24V

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