ASMPT Astro-Pro Bonding Machine
Wire Bonder

ASMPT

ASTRO-PRO

ISCOE139H

The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including:

-High precision die bonder/flip chip bonder
-Accuracy +/-2.5m @ 3 sigma
-Cycle-time of < 3 sec*
-Modular machine concept for all micro assembly applications
-Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
-Multi flip chip bonding
-Wafer mapping
-Post bond inspection/measurement
-Substrate working area of 550x600mm
-Active bond-force-control

AMICRA NOVA PLUS

AMICRA AFC Plus

MS90

The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.

LASER1205

Multi-Purposes Precision Pick & Place Tool

The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging.  Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.

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ASTRO-PRO

ISCOE139H

AMICRA NOVA PLUS

AMICRA AFC Plus

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