NEXX Systems found in 2001. In 2012 Tokyo Electron acquired NEXX and renamed it TEL NEXX, Inc. In 2018 ASMPT acquired the company and renamed it ASM NEXX, Inc.
ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes.

ASM / TEL / NEXX

NIMBUS XP

Stratus stands out as the top-tier solution for pattern plating and TSV applications, merging remarkable yield with cost-efficiency. Its ShearPlate technology simplifies process tuning, addressing the core challenges of production electrodeposition and ensuring unparalleled deposition uniformity. Catering to a range of applications from TSV to advanced packaging, Stratus' vertical design boasts up to 20 plating positions, guaranteeing high throughput and reduced maintenance. With its modular structure, Stratus is customizable to fit specific needs, available in two models - S200 and S300, and stands as the plating industry's gold standard for performance and adaptability.
ShearPlate technology ensures a uniform and thin fluid boundary layer, crucial for deposition uniformity and a wide chemical operating window in TSV and pattern plating. Stratus' vertical architecture, offering up to 20 metal plating positions, enables high throughput and system flexibility. Maintenance costs are minimized as Stratus requires only a single motion axis supported by magnetic bearings, unlike competing tools with multiple axes and mechanical bearings.

The modular architecture of Stratus allows for optimized system layouts tailored to specific process and throughput needs, from R&D to high-throughput production. It is available in two models, S200 (150/200 mm) and S300 (200/300 mm), each offering two configurations (FX with up to 10 plating cells and DX with up to 4 plating cells). Stratus sets the benchmark for performance, efficiency, and versatility in the plating industry."

STRATUS S200

Cirrus 150

NIMBUS 284

APOLLO Semi Automated

The Apollo 300 is a wafer sputtering tool from ASMPT NEXX. It is used for PVD 200-300 mm wafer processing and can be configured for up to 5 metals. It has applications in UBM/RDL, Fan Out, RF Filters, and Power Devices. It has a true bridge tool capability with size change, degas/anneal, and ICP/CCP etch. It can process 200 and 300 mm wafers including warped and heavy wafers made of silicon, EMC, RCP, glass, and bonded.

APOLLO 300

The Nimbus is a high throughput sputter deposition system. The unique and patented architecture incorporates the essential process steps in three vacuum chambers linked by a unique substrate transport system. This small footprint system, with ease of maintenance designed in, stands out in the market as providing outstanding cost of ownership.
Nimbus 300 - robotic wafer handling 100 to 200 mm.

NIMBUS 300

NIMBUS 314

The Nimbus is a high throughput sputter deposition system. The unique and patented architecture incorporates the essential process steps in three vacuum chambers linked by a unique substrate transport system. This small footprint system, with ease of maintenance designed in, stands out in the market as providing outstanding cost of ownership. There are three models:

Nimbus 250 - manual system for development and low volume production
Nimbus 300 - robotic wafer handling 100 to 200 mm (in production)
Nimbus 350 - 200 and 300 mm with either FOUP or SMIF interface

NIMBUS

Nimbus 310

APOLLO

ECD 300 – 200 mm Wafer Processing

Configurable for up to 6 metals
UBM/RDL
Fan Out
RF Filters
Power Devices

STRATUS P300

STRATUS S100

STRATUS S300

ECD 510 x 515 mm Panel Processing
Configurable for up to 5 metals

Multi-chip Fan Out
SoC packages
MicroLED

ASM / TEL / NEXX

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NIMBUS XP

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Cirrus 150

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