ADTEC Engineering designs and builds technologically advanced products, which through extensive market research, adapt to our customers' requirements. Our advanced technology has been applied in various fields of the electronics industry, generating several unique product lines.

ADTEC ENGINEERING

ADEX-3000P

Automatic Exposure System for Inner/Outer Layer Circuits 

ADEX-3000PV

Semi-Automatic Exposure System for Outer Layer Circuits for smaller boards.

EV-1200

Direct imaging exposure system. 
L/S = 8/8μm
PKG
40W
405 nm

IP-8 8000

For large size. This system uses UV exposure to create alignment marks on the DFR of inner layer boards without reference holes.
The system eliminates the need for reference hole processing, which is essential with single-sided to reversed single-sided exposure systems.

AMRK2000

For circuit formation. Basic Model By LED.

ADEX-3300P-LED

ADEX-3300S

This system uses UV exposure to create alignment marks on the DFR of inner layer boards without reference holes. The system eliminates the need for reference hole processing, which is essential with single-sided to reversed single-sided exposure systems.

AMRK1000

ADEX-5250S

Automatic Exposure System for Solder Resist

ANEX-A3161

Contact type exposure system. Basic model.

EV-7100 (SR)

Direct imaging exposure system for PLP.
L/S = 2/2μm
FO-WLP/ FO-PLP/ Organic PKG
405 nm

DE-2 P600

ADEX-3300P

Direct Write Exposure System for FO-WLP/PLP. DE-8 W300 for 300mm (12”) Wafer.

DE-8 W300

Direct Imaging Exposure System for Circuit Formation

IS-4000H

AFLX-2600P5

Roll to Roll Double-sided Simultaneous Exposure System.

AFLX-2600P

ADEX-2300PL

ADEX-5000S

Direct imaging exposure system.
L/S = 2/2μm
FO-WLP/ FO-PLP/ Organic PKG
405 nm

DE-2 W300

ADEX-4000S

For circuit formation. Large Panel Model.

ADEX-5300P

The copy frame is structured so that it can be pulled out to the front of the system. The automatic film-mask mounting function makes mask replacement work easier than ever before. The previous process of securing the film mask by tape is no longer necessary. In addition, the top-side copy frame rotates to realize ease of maintainability, making this a user-friendly system.

ADEX-2300P

Direct imaging exposure system.
L/S = 6/6μm
FPC
50W
405 nm

IP-6 HR

Automatic Double-sided Simultaneous Exposure System for Internal Layers.

ADE-1300P

Direct imaging exposure system.
L/S = 15/15μm
HDI
50W
405 nm

IP-15 UHT

Direct imaging exposure system.
L/S = 35/35μm
MLB
40W(IP-35 1000)
405 nm

IP-35 1000

Automatic Exposure System for Inner/Outer Layer Circuits.

ADEX-3000PB

Direct imaging exposure system.
L/S = 35/35μm
MLB
45W(IP-35L1000H)
405 nm

IP-35L1000H

ADEX-1300P

Direct Write Exposure System for FO-WLP/PLP. DE-8 P600 for 600 x 600mm Panel.

DE-8 P600

Direct Imaging Exposure System for Circuit Formation  

IP-3600HH

ADEX-5250P

Direct imaging exposure system.
L/S = 15/15μm
HDI
40W/50W
405 nm

IP-15 UHS

ADEX-6000S

ADEX-5300S

Direct imaging exposure system.
L/S = 15/15μm
HDI/MLB
45W/54W
405 nm

IP-15 L3800

For circuit formation. Middle Range Model.

ADEX-4000P

ACPM650 automatically peels off mylar cover film that had been applied on dry-film photoresist surface of printed circuit boards before development. ACPM650 peels off film on both sides of a board put in from the front-end process equipment and then sends the board to the developer.

ACPM650

ADEX-3300PL-LED

A new rendering engine that is integrated with advanced lens design technology is on-board our proprietary laser unit. One-time scan was also realized by arranging high quality and output laser heads in line at the board width. High quality exposure without shifting and misalignment between heads is achieved.

 IP-15 5000UH

Direct imaging exposure system.
L/S = 10/10μm
MSAP
40W
405 nm

IP-10 7000

Automatic Exposure System for Inner/Outer Layer Circuits

ANEX-A2161	

Direct imaging exposure system. 
L/S = 4/4μm*
PKG
40W/50W
405 nm

IP-4

Automatic Exposure System for Outer Layer Circuits for smaller boards

EV-2400

Direct imaging exposure system. 
L/S = 6/6μm
PKG
40W  
405 nm

IP-6 9000

EV-7100 (PT)

Direct imaging exposure system.
L/S = 12/12μm
MSAP
 40W
405 nm

IP-12 6000

Automatic Double-sided Simultaneous Exposure System for Internal Layers

ADTEC ENGINEERING

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