Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

This single-wafer, multi-chamber platform provides multi-chamber configurations. Applications include CVD, Etch, and Photoresist. The multi-chamber design of this platform allows for individual processes in each of the four chambers. The AMAT / APPLIED MATERIALS P5000 Mxp chamber 200mm is configured for 200mm wafers. Please see listings for chamber types added to the system. MXP chambers include: Oxide MxP+ (dielectric etch chamber), Poly Etch MxP (reactive Ion Etch chamber), Poly Etch MxP+ (reactive Ion Etch chamber), Metal Etch MxP (reactive Ion Etch chamber).

APPLIED MATERIALS (AMAT)

P5000 MXP CHAMBER 200MM

Photolithography

Similar Listings

P5000 MXP CHAMBER 200MM

Photolithography

Similar Listings