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MITSUBISHI ML605GTW4-UVF
    Description
    UV Laser Drilling Systems
    Configuration
    Mitsubishi UV Laser Drilling Machine Model: ML605GTW4-UVF20 Dimensions: 2400×2050×1950 mm Weight: 6000kg Stroke: X-Axis 900mm Y-Axis 700mm ZR-Axis 70mm ZL-Axis 70mm Power: 3 phases, 200V 50/60Hz, 220V 60Hz This UV laser drilling system achieves stable processing quality by installing a "high-speed UV laser oscillator" with a laser wavelength of 355 nm, which is suitable for processing the polyimide material, which is the main material for flexible substrates. Achieves high-speed machining with two machining heads and unique control technology High-speed processing of two work pieces (processing targets) simultaneously by mounting two processing heads Achieves high-speed trepanning processing by installing a high-speed UV laser oscillator / galvanic scanner and adopting the newly developed control system “Synchrom Technology” .
    OEM Model Description
    Laser Processing Machine
    Documents

    No documents

    MITSUBISHI

    ML605GTW4-UVF

    verified-listing-icon

    Verified

    CATEGORY

    Laser
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    13047

    Wafer Sizes:

    Unknown

    Vintage:

    2015

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    MITSUBISHI ML605GTW4-UVF
    MITSUBISHIML605GTW4-UVFLaser
    Vintage: 2015Condition: Used
    Last VerifiedOver 60 days ago

    MITSUBISHI

    ML605GTW4-UVF

    verified-listing-icon

    Verified

    CATEGORY

    Laser
    Last Verified: Over 60 days ago
    listing-photo-53f0f84c2f19942ccbca64fb81ea1fb17efdafb1c8f8cff9ffaf433be303d1a1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/d1b938bd3e91ca24550249a738c3dd3b5dd678458016796f85edce44e3b129bb/53f0f84c2f19942ccbca64fb81ea1fb17efdafb1c8f8cff9ffaf433be303d1a1/4ce4b3da5d9f67c4c72e8de13ed5f898f0fed7bf9e2258762e1453cc1df3abba_20200511_013900_f
    listing-photo-53f0f84c2f19942ccbca64fb81ea1fb17efdafb1c8f8cff9ffaf433be303d1a1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/d1b938bd3e91ca24550249a738c3dd3b5dd678458016796f85edce44e3b129bb/53f0f84c2f19942ccbca64fb81ea1fb17efdafb1c8f8cff9ffaf433be303d1a1/a628a30f823e07db71f27d25b647342788e2cb15ee7a5eb0536500b5c1ed0425_20200511_013900_f
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    13047

    Wafer Sizes:

    Unknown

    Vintage:

    2015

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    UV Laser Drilling Systems
    Configuration
    Mitsubishi UV Laser Drilling Machine Model: ML605GTW4-UVF20 Dimensions: 2400×2050×1950 mm Weight: 6000kg Stroke: X-Axis 900mm Y-Axis 700mm ZR-Axis 70mm ZL-Axis 70mm Power: 3 phases, 200V 50/60Hz, 220V 60Hz This UV laser drilling system achieves stable processing quality by installing a "high-speed UV laser oscillator" with a laser wavelength of 355 nm, which is suitable for processing the polyimide material, which is the main material for flexible substrates. Achieves high-speed machining with two machining heads and unique control technology High-speed processing of two work pieces (processing targets) simultaneously by mounting two processing heads Achieves high-speed trepanning processing by installing a high-speed UV laser oscillator / galvanic scanner and adopting the newly developed control system “Synchrom Technology” .
    OEM Model Description
    Laser Processing Machine
    Documents

    No documents

    Similar Listings
    View All
    MITSUBISHI ML605GTW4-UVF
    MITSUBISHI
    ML605GTW4-UVF
    LaserVintage: 2015Condition: UsedLast Verified: Over 60 days ago