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DYNATEX DXB 52501
    Description
    No description
    Configuration
    Dynatex DXB DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320 deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.
    OEM Model Description
    None Provided
    Documents

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    DYNATEX

    DXB 52501

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    17485

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
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    DYNATEX

    DXB 52501

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74/UdH1nlWvwZx73y6WsEJcTfdLoEdwYbpEp5I9JGOK0WE_20190301_114521_f
    listing-photo-IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74/DiTRTjJuWD7DRdPEG4OXFNq6-fwOPboef4WEEOCCkSs_20190301_114521_f
    listing-photo-IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74/7jrrnslgUysRFCFY8yk1Yriwsg0qaqj97rxNN6UZ0CU_20190301_114521_f
    listing-photo-IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74/MXSFebUaXV0TDF-BIackIL-ZprUIypYL5sfFsxRo1WA_20190301_114521_f
    listing-photo-IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/IDawAZtXSesd-U9S0LUtDv31Q7AYWwLz9uNfhGuZQ74/higUEOJo57TbBMHGe7EXqZEAMhIZqLLXZRqKQh83GYc_20190301_114521_f
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    17485

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Dynatex DXB DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320 deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.
    OEM Model Description
    None Provided
    Documents

    No documents

    Similar Listings
    View All

    No Similar Listings