BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

3100

3100

Category

Overview

Active Listings

Services

Top Listings

BESI / ESEC

3100

BESI / ESEC

3100

BESI / ESEC

3100

BESI / ESEC

3100

List it with Moov and find the perfect buyer in no time at all.