Overview

The AWC-650 Automatic Wafer Cleaner System leads the way in post-dicing wafer cleaning. Highly efficient and versatile in the removal of sub-micron particles from all sawed and scribed substrates, the AWC-650 is a robust and flexible system. This PLC controlled system provides effective and repeatable cleaning for worry-free processing of singulated substrates. Process parameters are easily modified and stored for building a process recipe library stored in the system memory.