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Description
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Vecco, VarianOEM Model Description
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.Documents
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CATEGORY
Wafer Handling
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115919
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BROOKS / PRI AUTOMATION
MAGNATRAN 8
CATEGORY
Wafer Handling
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115919
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Vecco, VarianOEM Model Description
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.Documents
No documents