The DISCO DFM2700 is a wafer mounter designed for semiconductor manufacturing. It automates the process of attaching wafers to dicing tape or tape frames and removing front-side protective tape. This equipment is particularly suitable for processing ultra-thin wafers, including those less than 25 μm thick, and is often integrated into inline systems with backgrinders like the DGP8760.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DFM2700

UH114-8 set the benchmark for control and
versatility. For dicing/sawing applications, uniform adhesive plastic film
lamination is paramount. The mounters feature an easily adjustable
spring-loaded roller assembly, along with film tensioner bars along
both the x- and y-axes to assure bubble-free lamination of the film to
the wafer and film frame. In addition, both models feature a retractable
film cutting system with adjustable cutting pressure to accommodate
various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements
and to accommodate various wafer thicknesses. A digital temperature
controller assures consistent workstage temperatures for repeatable
mounting. Adjustable alignment pins and vacuum cups accommodate
almost any type of film frame, including plastic. The workstage height
is also adjustable relative to the frame height for different wafer thicknesses.

Wafer / Film Mounter

Overview

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Manufacturers of Wafer / Film Mounter

Top Products for Wafer / Film Mounter

DFM2700

UH114-8

DFM-M150

WM-850