Description
No descriptionConfiguration
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MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.Documents
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ONTO / RUDOLPH / AUGUST
MetaPULSE 200
Verified
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
28261
Wafer Sizes:
8"/200mm
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / RUDOLPH / AUGUST
MetaPULSE 200
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
28261
Wafer Sizes:
8"/200mm
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.Documents
No documents