Description
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.Configuration
No ConfigurationOEM Model Description
None ProvidedDocuments
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KLA
FLX 2320A
Verified
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115322
Wafer Sizes:
Unknown
Vintage:
1993
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
FLX 2320A
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115322
Wafer Sizes:
Unknown
Vintage:
1993
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.Configuration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents