Overview

The MicroSense® BP1 is formerly known as the UltraMap UMA-200-BP. The MicroSense BP1 wafer measurement system precisely measures wafer thickness, flatness and shape using two patented, noncontact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement – the BP1 measures sawn, lapped or polished wafers.