Overview

The Temscal FC-3800 enables rapid processing of 150mm diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 150mm diameter wafers for lift off or thirty-six 150mm wafers for step coverage. The 38″ x 38″ x 28″ product chamber is pumped by a high throughput 16″ cryopump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10″ cryopump.