Overview

The FPA-3000i5 is a Fine Pattern Aligner that can write submicron images on a silicon wafer. It has a 0.35 µm lithography and can process 74 wafers per hour. It has a 0.63 NA and uses the latest off-axis illumination technique (SIA II). The FPA-3000i5 has improved lens performance, better wafer edge chip auto-focusing, and increased illumination intensity. It has a small footprint and a multitasking touch screen operation. It is compatible with Canon’s family of lithography steppers.