SE 200 unique over-the-line design fits into almost any SMT assembly line, existing or new. Installed immediately following the screen printer, SE 200 inspects wet solder paste and notifies the operator of any printing irregularities. By identifying potential problems before the PCB is populated, adjustments can be made before yield is affected.

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SE200

SE500 SPI

SE 350

High speed, All-in-one' scan, on-the-fly measurement @ 210 cm2/sec

SE500 Ultra

SE500

SE600 comes with a standard dual illumination sensor designed and built exclusively by CyberOptics. The sensor offers the best repeatability and reproducibility results-even on the smallest paste deposits. The sensor is manufactured as an integrated assembly with absolutely no moving parts - which means no machine-to-machine variation. So, you can be assured that there is no drift over time, no parts to wear and most importantly - no recalibration required.

SE600

SE 300

CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.

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SE200

SE500 SPI

SE 350

SE500 Ultra

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