MC600i
Category
Scribing, Cutting, DicingOverview
MC600i is a fifth generation version of the award-winning Nano Cleaving series of the sample preparation systems for cross-section of crystalline materials for following SEM inspection and other analyses. The MC600i system utilizes Nano Cleaving and Micro Cleaving technologies in two main processes – full process and fast process. SELA’s Nano Cleaving and Micro Cleaving technologies are proved themselves as undisputed leaders for accurate, fast and artifact-free sample preparation. The MC600i system achieves fully automatic, reliable and rapid cross sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, automatic off-loading for immediate inspection. High and consistent accuracy and excellent quality of cross-sections significantly reduce diagnostic cycle for failure analysis, characterization and process monitoring.
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