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3121-1FA
Category
Scribing, Cutting, DicingOverview
Full Auto Wafer Breaker Feature: -SECS / GEM functions -Breaks 12″ wafer attached to 12″ frame -OCR Wafer ID identification -Capable of working on wafers with metal balls on surface -Breaks 8″/ 12″ wafers by switching with software, without the need to change conversion kit -Image acquisition from front or back of the wafer can be set by recipe depending on product requirements -Special cushioned platform structure to improve product breaking yields -Advanced dust collection for instant dry cleaning
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