Description
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The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ~ 600 mm/s.Documents
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DISCO
DFL7560L
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
66578
Wafer Sizes:
Unknown
Vintage:
2016
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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Similar Listings
View AllDISCO
DFL7560L
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
66578
Wafer Sizes:
Unknown
Vintage:
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ~ 600 mm/s.Documents
No documents