Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo
6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
DISCO DFD-2D/8
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor wafers. The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting.
    Documents

    No documents

    DISCO

    DFD-2D/8

    verified-listing-icon

    Verified

    CATEGORY
    Scribing, Cutting, Dicing

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    92615

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFD-2D/8

    DISCO

    DFD-2D/8

    Scribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    DISCO

    DFD-2D/8

    verified-listing-icon
    Verified
    CATEGORY
    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-0e08850db14d46ee9ba62ed9bba103b3-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    92615

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor wafers. The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFD-2D/8

    DISCO

    DFD-2D/8

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:Over 60 days ago